描述
PC树脂玻璃纤维增强
特点：无卤阻燃，高流动性，高耐热性
用途：显示屏前框、后壳、笔记本电脑壳、电子电器等。
PC树脂玻璃纤维增强
产品详细信息
在普通工程塑料中，PC的吸水率最小，正常使用时吸水率为0.17%。虽然PC的吸水率不大，但由于酯基易于高温水解，在成型加工温度（221-301℃）下少量水分也会导致其降解，释放CO2和其他气体，导致变色，相对分子量急剧下降，产品表面出现银丝、气泡等。因此，PC在成型前必须干燥，以将其水分含量降至0.04%以下。一般来说，干燥温度应低于136°C，干燥时间因不同的干燥方法而异。PC高分子链是刚性的，其熔体粘度高，其流动特性接近牛顿流体，即熔体粘度受剪切速率的影响较小，且对温度变化敏感。因此，在PC成型过程中，经常使用温度来调节熔体的流动性，并且需要更高的成型压力。此外，在注塑过程中，应适当提高模具温度，以降低产品的内应力。根据产品厚度，模具温度应控制在81-121°C。冷却时PC熔体收缩均匀，成型收缩率小，一般在0.5%-0.9%范围内。通过正确控制熔体温度、模具温度、注射压力和保温时间等工艺条件，可以生产出高尺寸精度的产品。如果需要进一步提高产品的尺寸稳定性，可以在111-136°C下对产品进行热处理。热处理可以降低PC在成型过程中产生的内应力，提高其拉伸强度、弯曲强度、硬度和热变形温度。PC产品的热处理是提高其尺寸稳定性和抗环境应力开裂性的常用方法。然而，应注意的是，热处理后，由于结晶的增加，冲击强度通常会降低
PC Resin Glass Fiber Reinforced
Features: halogen-free flame retardant,
high fluidity, high heat resistance.
Application: display front frame and back shell,
notebook shell, electronic appliances, etc.
PC Resin Glass Fiber Reinforced
Product Details
PC resin glass fiber reinforced
The water absorption rate of PC is the smallest among general engineering plastics, with a water absorption rate of 0.17% in normal use. Although the water absorption rate of PC is not large, because the ester group is prone to high temperature hydrolysis, a small amount of moisture at the molding processing temperature (221-301 ℃) can also cause its degradation, release CO2 and other gases, cause discoloration, and a sharp drop in relative molecular weight. , Silver wire, bubbles, etc. appear on the surface of the product. Therefore, PC must be dried before molding to reduce its moisture content to below 0.04%. Generally, the drying temperature should be below 136°C, and the drying time varies with different drying methods. The PC macromolecular chain is rigid, its melt viscosity is high, and its flow characteristics are close to Newtonian fluids, that is, the melt viscosity is less affected by the shear rate and is sensitive to temperature changes. Therefore, the temperature is often used to adjust the fluidity of the melt in the PC molding process, and a higher molding pressure is required. In addition, the mold temperature should be appropriately increased during injection molding to reduce the internal stress of the product. According to the thickness of the product, the mold temperature should be controlled at 81-121°C. The PC melt shrinks uniformly when cooled, and the molding shrinkage rate is small, generally in the range of 0.5%-0.9%. By correctly controlling process conditions such as melt temperature, mold temperature, injection pressure and holding time, products with high dimensional accuracy can be produced. If it is necessary to further improve the dimensional stability of the product, the product can be heat-treated at 111-136°C. Heat treatment can reduce the internal stress generated by PC in the molding process, and improve its tensile strength, bending strength, hardness and thermal deformation temperature. Heat treatment of PC products is a common method to improve their dimensional stability and environmental stress cracking resistance. However, it should be noted that after heat treatment, the impact strength is often reduced due to the increase of crystallization.
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