描述

耐候性聚甲醛芯片颗粒MFI 19

产品：耐候性聚甲醛芯片颗粒MFI 19

高耐磨性

低摩擦系数

高耐热性

良好的电气和介电性能

低吸水性

耐候性聚甲醛芯片颗粒MFI 19

产品详细信息耐候性聚甲醛芯片颗粒MFI 19是一种坚硬致密的材料，表面光滑、有光泽，浅黄色或白色，薄壁部分半透明

燃烧特性易于燃烧，离开火后继续燃烧。火焰上端为黄色，下端为蓝色，熔化滴落，有强烈的刺激性甲醛味和腥味

比重为1.41-1.43克/立方厘米，

成型收缩率为1.2-3.0%，

成型温度170-200℃，

干燥条件为80-90°C，干燥2小时

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Weather Resistance POM Chips Pellet MFI 19

Product : Weather resistance POM Chips Pellet MFI 19
High abrasion resistance
Low coefficient of friction
High heat resistance
Good electrical and dielectric properties
Low water absorption

Weather Resistance POM Chips Pellet MFI 19

Product Details

Weather resistance POM Chips Pellet MFI 19

Polyoxymethylene is a hard and dense material with a smooth, shiny surface, light yellow or white, and the thin-walled part is translucent.

The burning characteristics are easy to burn, and continue to burn after leaving the fire. The upper end of the flame is yellow, and the lower end is blue, melting and dripping occur, and there is a strong irritating formaldehyde smell and fishy smell.

Polyoxymethylene is white, generally opaque, and has good colorability.

The specific gravity is 1.41-1.43 grams/cubic centimeter,

The molding shrinkage rate is 1.2-3.0%,

Molding temperature 170-200℃,

Drying conditions are 80-90°C for 2 hours.

The long-term heat resistance of POM is not high, but it can reach 160°C in the short-term. The short-term heat resistance of homopolymerized POM is more than 10°C higher than that of copolymerized POM, but the long-term heat-resistant copolymerized POM is about 10°C higher than that of homopolymerized POM. It can be used for a long time in the temperature range of -40℃～100℃.

POM is very easy to decompose, the decomposition temperature is 240 degrees, and irritating and corrosive gases are generated during decomposition. Therefore, the mold steel should be made of corrosion-resistant materials.

Contact Now For Weather resistance POM Chips Pellet MFI 19.

Tina Lin < Email : ###>